Investing Profile

Jerry Yang(223)

VCInvestor
General Partner at HCVC
hcvc.coSan Francisco, California
Photo of Jerry Yang, General Partner at Hardware Club

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11 Investors

Connected to Hans Tung (GGV Capital), Evan Nisselson (LDV Capital), Marvin Liao (GAMEGROOVE Capital), and 8 other investors on Signal.

HEC Paris Network
26 CONNECTIONS
Qualcomm Network
16 CONNECTIONS
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Hardware Club General Partner
$100K - $1.5M
$500K
124
CompanyStageDateRound SizeTotal Raised
Caden
Series AAug 2023$15M
SeedNov 2022$6M
Pre SeedApr 2021$3M
$30M
Co-investors: Jerry Yang (AME Cloud Ventures), Ullas Naik (Streamlined Ventures), Todd Kimmel (Montage Ventures), Jonathan Roosevelt (Industry Ventures), Matthew Murphy (Montage Ventures)
Semafor
SeedMay 2023$19M
$38M
Co-investors: Jerry Yang (AME Cloud Ventures)
Ronbow
Series AApr 2023$10M
$10M
Co-investors: Jerry Yang (AME Cloud Ventures)
Fairmatic
Series BMar 2023$46M
Series AAug 2022$42M
$88M
Co-investors: Jerry Yang (AME Cloud Ventures), Charles Moldow (Foundation Capital), Oren Zeev (Zeev Capital), Bill Tai
Giraffe360
Series ANov 2022$16M
SeedNov 2020$5M
$26M
Co-investors: Todor Breshkov (LAUNCHub Ventures), Hussein Kanji (Hoxton Ventures)
Sarcura
SeedNov 2022$7M
$7M
€9.6M
Co-investors: Jerry Yang (AME Cloud Ventures), Marta-Gaia Zanchi (Nina Capital), Florian Resch (IST cube)
Somewear Labs
Series ASep 2022$14M
$28M
Co-investors: Jerry Yang (AME Cloud Ventures), Scott Sandell (New Enterprise Associates (NEA)), Geoff Yang (Redpoint Ventures), Benjamin Ling (Bling Capital), Grant Newlin (Newlin), Maynard Webb (Webb Investment Network), Harris Barton, Thomas Noonan, Sam Palmisano, Grant Newlin
QDC.ai
Pre SeedSep 2022
Co-investors: Jerry Yang (AME Cloud Ventures), Jeff Chung (AME Cloud Ventures), Michael Marquez (Morado Venture Partners)
General Partner Hardware Club2015 - Present
Speaker at Slush Tokyo 2017 Slush2017 - 2017
Speaker at TIA Tokyo 2016 Tech in Asia2016 - 2016
Venture Capitalist Truffle Capital2014 - 2014
Design Project Lead Altis Semiconductor2012 - 2013
Member of Technical Staff Qualcomm2008 - 2012
Entrepreneur Chip Advanced Technology (acq. by ITE Tech Inc. in 2008)2004 - 2008
Senior Mixed-Signal IC Design Engineer Silicon Integrated Systems.2000 - 2004
HEC Paris MBA Finance, GPA 3.98
National Taiwan University Master of Electrical Engineering Analog, Mixed-Signal, RF IC design
National Taiwan University Bachelor of Electrical Engineering Electrical Engineering